PRODUCT OVERVIEW
BE SENSITIVE TO CHANGE,
BE READY TO TRANSFORM
Sputtering Target Indium Bonding Back plate
- Rare Earths Element
- AIN SiC Si3N4 BN/PBN Al2O3 ZrO2 Metallized ceramic Porous Ceramic
- Nickel anode for plating, Ti, Zr, Mo, W, Hf Nickel-based special alloy
- Bio-soluble Fiber Inorganic Board
- Sputtering Target Indium Bonding Back plate
- E-Beam Source Crucible, headter Filament, Crystal Sensor
- FOUNDARY SERVICE, THIN FILMDEPOSITION SERVICE
- Vacuum induction melting service
Rare Earth Element
AIN SiC Si3N4 BN/PBN Al2O3 ZrO2
Metallized ceramic Porous ceramic
Nickel anode for plating,
Ti, Zr, Mo, W, Hf
Nickel-based special alloy
Bio-soluble Fiber
Inorganic Board
Sputtering Target
Indium Bonding
Back plate
E-Beam Source
Crucible, heater
Filament, Crystal Sensor
FOUNDRY SERVICE,
THIN FILM DEPOSITION SERVICE
Vacuum induction
melting service
Sputtering Target
Indium Bonding
Back plate
Pure And Alloy
Metal target
It is produced metal targets by Thifine with pure Korean technology.
We develop and manufacture targets according to the thin film
characteristics required by customers.
- Purity : 99 ~ 99.9999%
- Size : follow the customer specification
- Grain Size : 50㎛ under
Pure And Alloy
Ceramic target
We manufacture targets using various ceramic
materials such as oxide, sulfide, nitride, and phosphide.
We develop and manufacture targets according
to the thin film characteristics required by customers.
- Purity : 99 ~ 99.9999%
- Size : follow the customer specification
- Sintering : CP, HP, CIP, HIP
Pure And Alloy
Precious metal target
We make perfect and reliable products by issuing guarantees for
all products such as gold, silver, palladium, platinum, etc.
We develop and manufacture targets according
to the thin film characteristics required by customers.
- Purity : 99 ~ 99.9999%
- Size : follow the customer specification
- Recycling : Cost reduction by 100% recycling of targets, sputter fixture, and products
Back plate
99.998% oxygen-free copper is used for the perfect leakage control.
It is processed with a tolerance of 1/1000mm and there is no size limit.
Through the brazing process, a complex back plate in a
three-dimensional form is produced.
Indium bonding
Bonding is possible for all types of targets and there is no size limit.
After bonding, a bonding rate of 99% or higher is guaranteed
and confirmed through an ultra sonic test.
Depending on the materials, silver paste bonding
and diffusion bonding are possible also.
